Samsung is reportedly gearing up to launch its Galaxy Z Flip 7, featuring the new Exynos 2500 chipset in most global markets. According to rumors, this chip will likely be utilized in regions including India and South Korea. However, for the U.S., Canada, and China, it is believed that the device will be powered by the Snapdragon 8 Elite, similar to the forthcoming Galaxy S25 series. These insights come from reliable sources, indicating that the model number S5E9955 is associated with the Exynos 2500, Samsung’s in-house system-on-chip (SoC).
This strategy aligns with Samsung’s previous practice of using Exynos chips in specific countries while opting for Qualcomm processors in others. On a different note, there are speculations about design changes for the Galaxy Z Flip 7, particularly regarding its hinge. Reports suggest Samsung is considering employing a titanium hinge for its upcoming foldable devices, including the Galaxy Z Fold 7. This material is appreciated for being lightweight and strong, which could potentially benefit larger devices.
However, it has not been confirmed if the Galaxy Z Flip 7 will feature this new hinge technology, implying it may retain the existing hinge design from the Flip 6. Earlier reports had raised concerns regarding production issues with the Exynos 2500, casting doubt on its debut. Despite these setbacks, the chipset is expected to deliver enhanced performance, featuring a 10-core arrangement that includes an upgraded Cortex X-5 CPU. Anticipation builds as the Galaxy Z Flip 7 is expected to launch during Samsung’s summer Unpacked event, alongside the Fold 7.
As Samsung continues to evolve its foldable offerings, tech enthusiasts eagerly await the official announcement.